Broadcom has extended its partnership with Meta to develop multi-gigawatt custom silicon, starting with an initial commitment that exceeds 1GW in the first phase. This collaboration, which focuses on next-generation AI accelerator chips, is set to deliver advancements through 2029. As part of the partnership, Broadcom CEO Hock Tan will step down from Meta’s board to serve as an advisor, a move aimed at minimizing conflicts as the two companies intensify their chip collaboration. This initiative builds on Meta’s previous success, having unveiled four generations of Broadcom-built MTIA chips optimized for various AI workloads.

Meta: Meta Platforms operates major social networks and invests in custom AI infrastructure to support its recommendation systems and generative AI features. It has developed the MTIA family of homegrown AI chips in partnership with Broadcom. The company is deepening this collaboration to deploy advanced custom silicon through 2029.
Broadcom: Broadcom is a semiconductor company that designs custom AI accelerator chips and provides essential infrastructure components like optical interconnects for large-scale AI data centers. It collaborates closely with hyperscalers to develop tailored silicon for AI training and inference. In this news, Broadcom is extending its partnership with Meta to supply next-generation MTIA custom silicon over the next three years.
Hock Tan: Hock Tan is the President and CEO of Broadcom, leading its growth in custom AI semiconductors for cloud giants. He previously served on Meta’s board of directors. In connection with the expanded Broadcom-Meta partnership, Hock Tan is transitioning off the board to an advisory role to address potential conflicts.

`json
{
“Leadership Change”: “Broadcom CEO Hock Tan steps from Meta’s board to advisor to support the intensified chip collaboration without conflicts.”,
“Partnership Expansion”: “Broadcom and Meta are co-developing next-generation AI accelerator chips under the MTIA program spanning multiple years.”
}
`